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Certifications
Recently viewedFRAUD PREVENTION REMINDERS
Recently, We have discovered that criminals falsely claimed to be WIN SOURCE to commit fraud.
Please note that the only official website & email suffix are
www.ontruthchip.com
More details about fraud preventionHSB13-303014
- Part No
- HSB13-303014
- Manufacturer
- CUI Devices
- Package/Case
- -
- Datasheet
- Download
- Description
- HEAT SINK, BGA, 30.7 X 30.7 X 14
- Stock
- 524
Shipping Information
Shipped from HK warehouse Expected Shipping Date Mar 9 to Mar 10 2023 Ship today if order in 3:26:31 (HKT)Supplier Lead-Time Call for availability Estimate shipping fee Enter your destination to get a shipping estimateEstimate shipping fee- Manufacturer :
- CUI Devices
- Product Category :
- Thermal - Heat Sinks
- Attachment Method :
- Adhesive
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- BGA
- Power Dissipation @ Temperature Rise :
- 6.1W @ 75°C
- Product Status :
- Active
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 4.70°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 12.36°C/W
- Type :
- Top Mount
- Datasheets
- HSB13-303014
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Integrated Circuits (ICs)
