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HSE-B18317-035H-01

Part No
HSE-B18317-035H-01
Manufacturer
CUI Devices
Package/Case
-
Datasheet
Download
Description
HEAT SINK, EXTRUSION, TO-218, 31
Stock
35000

Shipping Information

Shipped from HK warehouse
Expected Shipping Date Mar 9 to Mar 10 2023
Ship today if order in 3:26:31 (HKT)
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Manufacturer :
CUI Devices
Product Category :
Thermal - Heat Sinks
Attachment Method :
Clip and PC Pin
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
TO-218
Power Dissipation @ Temperature Rise :
10.0W @ 75°C
Product Status :
Active
Shape :
Rectangular, Angled Fins
Thermal Resistance @ Forced Air Flow :
4.33°C/W @ 200 LFM
Thermal Resistance @ Natural :
7.50°C/W
Type :
Board Level, Vertical
Datasheets
HSE-B18317-035H-01

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